DuPont™ Kalrez® 6375UP

To transform raw semiconducting materials into a useful device requires hundreds of chemical processing
steps. A significant number of these steps involve aggressive acids, solvents, and bases (including
amines) used to clean, rinse, etch or strip unwanted materials and contaminants from the wafer surface.
These chemicals can attack elastomeric seals causing them to swell and degrade or to leach undesirable
metallic and ionic extractables that affect integrated circuit functionality.

Description

Optimal Seal Performance and Lower Cost of Ownership for Semiconductor Applications

To transform raw semiconducting materials into a useful device requires hundreds of chemical processing steps. A significant number of these steps involve aggressive acids, solvents, and bases (including amines) used to clean, rinse, etch or strip unwanted materials and contaminants from the wafer surface. These chemicals can attack elastomeric seals causing them to swell and degrade or to leach undesirable
metallic and ionic extractables that affect integrated circuit functionality.

The trend toward larger wafers, smaller feature size, and decreasing thickness of deposited layers has placed increased emphasis on the need to minimize or eliminate sources of process contamination. Chemical and equipment manufacturers go to great lengths to minimize the potential for contamination that could result in chip defects.

DuPont has developed a number of products that resist chemical attack and are formulated and processed to minimize the potential for undesirable contaminants. The newest addition to our product line, DuPont™ Kalrez® 6375UP, has an excellent balance of performance characteristics required for semicon wet processing environments.

Process Type Typical Chemicals Temp. Range, °C DuPont™ Kalrez® 6375UP DuPont™ Kalrez® 4079UP DuPont™ Kalrez® 1050UP
Wafer Prep, Cleaning, and Rinsing

UPDI, Ozonated DI H20

TCE, IPA, Acetone

Piranha, SC-1, SC-2 HF (49%), O3

25-125 Suggested Compound Suitable Alternate Consult DuPont
Wet Etching

HNO3/HF/H20

H3PO4/HNO3/Acetic/H20

H3PO4/HNO3/HF/H20,H3PO4

25–180 Suggested Compound Suitable Alternate Consult DuPont
Photolithography Developing, Stripping, Rinsing H2SO4 + Oxidant Organic Acids Chromic/Sulfuric Acid 25–125 Suggested Compound Suitable Alternate Consult DuPont

NaOH, TMAH

Xylene, Stoddard

Solvent nMP

25–125 Suggested Compound Suitable Alternate Consult DuPont

NMP/Alkanolamine

DMSO/MEA

DMAC/DEA Hydroxylamine

25–125 Suggested Compound Consult DuPont Suitable Alternate
Copper Plating

CuSO4 Solution

H2SO4, H2O2

UPDI, Citric Acid

25–100 Suggested Compound Suitable Alternate Consult DuPont

Note: Product ratings are based on a combination of chemical resistance and extractable performance. In applications where extractables are not a critical concern, multiple products may be appropriate. For further assistance, contact DuPont and ask to speak with a Kalrez® Applications Engineer.

DuPontKalrez® Offers Excellent Resistance to Chemical Attack

For many applications, low volume swell of elastomers is critical for proper equipment operation. Excessive swell may cause permanent seal failure due to equipment hang-up, extrusion, etc. While other physical property testing may be needed to adequately define product performance in a particular application, volume swell is an excellent indicator of resistance to chemical attack. The following data represents a summary of internal and external compatibility tests performed to determine the volume swell of products suggested for semiconductor wet process environments.

Immersion Chemistry Exposure Conditions Volume Swell
DuPont™ Kalrez® 6375UP DuPont™ Kalrez® 4079UP DuPont™ Kalrez® 1050UP
UPDI Water

Piranha

SC-1

SC-2

49% HF

Ammonium Hydroxide

85 °C, 30 days

25 °C, 30 days

25 °C, 30 days

25 °C, 30 days

25 °C, 30 days

100 °C, 7 days

0.7

0.1

0.6

0.1

2.8

2.6

2.3

0.1

1.1

0.1

0.6

9.8

5.5

0.1

0.6

0.2

1.8

Not Tested

Sulfuric Acid (H2SO4)

Nitric Acid (HNO3)

Phosphoric/Acetic/Nitric Acid

Hydrofluoric Acid/HNF4

Hydrochloric, Nitric Acid and H2O

120 °C, 30 days

85 °C, 7 days

60 °C, 28 days

60 °C, 28 days

60°C, 28 days

1.3

2.1

1.0

0.0

5.0

0.8

1.5

1.0

1.0

6.0

2.8

Not Tested

Not Tested

Not Tested

Not Tested

n-Methylpyrrolidone

Dimethyl Acetamide

80 °C, 7 days

80 °C, 7 days

2.0

2.4

2.4

4.0

3.2

4.4

ACT 690C

ACT-NP870

ACT 935

ACT NE-14

ACT CMI

95 °C, 10 days

80 °C, 10 days

80 °C, 10 days

25 °C, 10 days

80 °C, 10 days

1.5

2.0

1.6

0.0

2.7

7.9

6.2

5.1

0.0

6.5

2.0

2.0

1.8

0.3

5.2

EKC265

EKC830

EKC4000 PCT

75 °C, 7 days

75 °C, 7 days

75 °C, 7 days

1.0

3.1

0.7

2.8

10.0

1.7

0.7

10.1

2.5

PRS-1000

PRS-3000

ALEG™310

REZI 28

95 °C, 10 days

80 °C, 10 days

80 °C, 10 days

80 °C, 10 days

1.5

2.0

1.6

2.7

7.9

6.2

5.1

6.5

2.0

2.0

1.8

5.2

* Note: The volume swell values above should be used as an approximate indicator of relative compatibility performance. Generally <10% volume swell is desirable.

Keep Contamination Under Control with Kalrez® Parts

Semiconductor devices are vulnerable to many types of contaminants including trace chemicals (anions and total organic carbons—TOCs), metallic ions, and particles.

Chemical Contamination (anions and TOCs)

Two of the major sources of contamination in semiconductor processes are trace elements of unwanted chemicals (anions) and organic contaminants (TOCs). Process chemicals and process water can become contaminated and interfere with wafer processing. Chlorine (i.e., chloride ion) is such a contaminant and is rigorously controlled in process chemicals. In UPDI systems, TOCs can adhere to wafer surfaces and adversely affect oxide quality or film quality.

Elastomeric seals can be a source of this contamination. DuPont has developed products to minimize the potential for chemical and organic contamination.

Chloride Ion Extractables After Immersion in UPDI Water for 1 Month at 85 °C
Total Oxidizable Carbon After Immersion in UPDI Water for 1 Month at 85 °C

Metallic Ion Contamination

Process chemicals can cause metallic ions to leach out of seal materials. These metallic ions, depending on type and quantity, can alter electrical properties and cause device failure to occur. Below is a summary of total metallic extractables after immersion of O-rings in various cleaning and wafer preparation process chemicals. DuPont™ Kalrez® 6375UP has an excellent balance of chemical resistance and low metallic extractables in a variety of process fluids.

Total Metallic Extractables by ICP-MS

Typical Physical Properties

Kalrez®Product Color Hardness Shore A (pellet) (method ASTM D2240) Hardness Shore M (O-ring) (method ASTM D2240 & ASTM D1414) Max. Cont. Service Temp °C 100%Modulus MPa (method ASTM D412) Compression Set at 70 hr 204°C, % (method ASTM D395)
6375UP Black 75 83 275 7.23 25
4079UP Black 75 83 316 7.23 25
1050UP Black 82 288 12.40 35

Warranty for Kalrez products

• Only applies to Dupont products distributed genuine in Vietnam.

• All Kalrez products are warranted if the machine fails due to manufacturer fault.

• For warranty and product maintenance, please contact Achilles, customer service phone number: 098 213 2184 (Ms. Duc).

• Achilles is the genuine supplier of products related to Kalrez DuPont.

• For retail/whole sale pricing, bulk ordering and product information advice please contact 098 213 2184 (Ms. Duc) via info@achilles.com.vn or the website https://achilles.com/.

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