DuPont™ Kalrez® 6375UP

To transform raw semiconducting materials into a useful device requires hundreds of chemical processing
steps. A significant number of these steps involve aggressive acids, solvents, and bases (including
amines) used to clean, rinse, etch or strip unwanted materials and contaminants from the wafer surface.
These chemicals can attack elastomeric seals causing them to swell and degrade or to leach undesirable
metallic and ionic extractables that affect integrated circuit functionality.