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Suba™ Polishing Pads
DuPont’s Suba Polishing Pads are chemical mechanical planarization (CMP) pads for stock, intermediate and final polish. They offer significant advantages in achieving consistent, reproducible results in polishing semiconductor wafers, glass and ceramics.
The Suba™ family of polishing pad products is the industry standard for silicon stock removal polishing. They may also be used as a sub-pad.
- Suba™ Polishing Pad Series
Benefits:
- High removal rate silicon stock polishing pad
Applications:
- Silicon wafer polishing
- Polishing fragile crystals or other delicate surfaces
- Polishing glass, quartz, ceramics, special metals and plastic
Warranty for CMP Pads product
• Only applies to Dupont products distributed genuine in Vietnam.• All Suba Polishing Pads products are warranted if the machine fails due to manufacturer fault.• For warranty and product maintenance, please contact Achilles, customer service phone number: 097 613 7653 (Ms.Mai)• Achilles is the genuine supplier of products related to DuPont• For retail/whole sale pricing, bulk ordering and product information advice please contact 097 613 7653 (Ms.Mai) via info@achilles.com.vn or the website https://achilles.com.vn
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